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Conferences > DFM > 1995 > DTPA > DTPA603
  • Applications of Diamond Films and Related Materials: Third International Conference
  • Technical Digest Series (Optica Publishing Group, 1995),
  • paper DTPA603

Thermal Aspects of High Performance Packaging with Synthetic Diamond

P. J. Boudreaux

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Abstract

The extraordinary thermal conductivity and dielectric properties of diamond translate into performance and reliability advantages for electronic packaging of high performance semiconductors. Demonstrated diamond substrate Pin Grid Array (PGA) packages and Multi Chip-Modules (MCM) have changed the whole approach to high performance computing. Subnanosecond computer performance is made possible for the first time by a diamond substrate 3-D architecture.

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