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Conferences > IPR > 1994 > SaE > SaE2

Thermal Design of Uncooled Edge Emitting InP Laser Array Package using Silicon Optical Bench Technology

Yiu-man Wong, Fred Warning, and John Zilko

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Abstract

A low cost passive alignment of laser array chips to multimode optical fibers has been reported1 recently using flip-chip bump bonding and silicon optical bench technology. The thermal design for AuSn and PbSn solders of different dimensions has been reported2. However, in flip-chip bonding of a laser array with the p+ active side down, two practical issues have been identified and will be addressed in this paper.

© 1994 Optical Society of America

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