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Self-aligned Tilted Amplifier Array Packaging using Si V-groove Flip-Chip Technique for Gate Array Applications

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Abstract

For the first time an optical self-aligned flip-chip packaging technique for tilted amplifier arrays using Si V-grooves and angle polished fiber arrays with fiber-to-fiber gain of 8±1 dB and ripple < 0.2 dB is demonstrated.

© 1994 Optical Society of America

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