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Optica Publishing Group
  • Integrated Photonics Research
  • OSA Technical Digest (Optica Publishing Group, 1998),
  • paper ITuF3

Non-peripheral epilayer cleaving of GaAs for hybrid device applications

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Abstract

Hybrid integration of bulk or waveguide devices of different material systems permits increased optical integration and enhanced complexity of device functionality on a single chip.

© 1998 Optical Society of America

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