Abstract

Separating the substrate allows thin layers of III-V photonic semiconductor materials and devices to be integrated on foreign templates using transfer-printing. We demonstrate advanced light emitting and detecting devices based on this principle.

© 2017 Optical Society of America

PDF Article
More Like This
III-V/Silicon Photonics: Technology and Integrated Devices

G. Roelkens, L. Liu, J. Brouckaert, J. Van Campenhout, F. Van Laere, D. Van Thourhout, and R. Baets
IMC1 Integrated Photonics and Nanophotonics Research and Applications (IPNRA) 2008

Monolithically Integrated III-V Gain Material on Virtual Substrates on Si Using Template-Assisted Selective Epitaxy

Benedikt Mayer, Stephan Wirths, Lukas Czornomaz, Heinz Schmid, Marilyne Sousa, Heike Riel, and Kirsten Moselund
CE_5_1 The European Conference on Lasers and Electro-Optics (CLEO_Europe) 2017

III-V/Si PICs based on micro-transfer-printing

Gunther Roelkens, Jing Zhang, Grigorij Muliuk, Jeroen Goyvaerts, Bahawal Haq, Camiel Op de Beeck, Alexandros Liles, Zheng Wang, Sören Dhoore, Sulakshna Kumari, Joan Juvert, Joris Van Campenhout, Bart Kuyken, Dries Van Thourhout, Brian Corbett, Antonio Jose Trindade, Chris Bower, and Roel Baets
W4E.6 Optical Fiber Communication Conference (OFC) 2019

References

You do not have subscription access to this journal. Citation lists with outbound citation links are available to subscribers only. You may subscribe either as an Optica member, or as an authorized user of your institution.

Contact your librarian or system administrator
or
Login to access Optica Member Subscription