Abstract

Thin films of diamond phase carbon can be grown by a wide variety of chemical vapor deposition techniques, including hydrocarbon combustion and hydrogen rich hydrocarbon plasmas at atmospheric and sub-atmospheric pressures. The excellent thermal conductivity and high electrical resistance of diamond make it an attractive material for a wide variety of thermal management applications. Low cost, uniform deposition over large areas would make polycrystalline diamond an ideal substrate for high speed electronic circuit packaging in multi-chip modules. Thus, reactors which can rapidly deposit diamond and can be scaled to large area deposition are most attractive for these practical applications.

© 1996 Optical Society of America