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Conferences > Networks > 2022 > NeTu1D > NeTu1D.2

Motion: A High speed, low cost, low energy chip scale optical module for co-packaging on a first-level organic substrate for HPC and Data Centers

D. Kuchta, M. Meghelli, P. Pepeljugoski, L. Schares, M. Schultz, P. Maniotis, P. Fortier, E. Tucotte, C. Bureau, M. Pion, Y. Cossette, G. Jutras, B. Sow, B. Parikh, S. Ostrander, S. Li, D. Becker, F. Gholami, H. Bagheri, F. Flens, G. Light, and B. Wang

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Abstract

We report on progress and results towards the development of a high speed, low cost, low energy (<4pJ/bit) chip scale optical module for co-packaging on a first-level organic substrate for HPC and Data Center applications.

© 2022 The Author(s)

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