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Conferences > OFC > 2023 > M4E > M4E.6

Developments of VCSEL-based transceivers for Co-Packaging

Daniel M. Kuchta

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Abstract

This paper covers recent industry developments in VCSEL-based transceivers that are designed for co-packaging on a first level package with ASICs, such as CPUs, GPUs, and data center switches.

© 2023 The Author(s)

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More Like This
Progress of High-speed VCSELs and VCSEL-based Co-Packaging for Short Reach Communications

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AM1R.1 CLEO: Applications and Technology (CLEO:A&T) 2023

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