Abstract

The development of high-power UV excimer laser sources has opened up many new opportunities in applications of lasers to material processing. The recent development of many new nonlinear optical materials has further extended the spectral coverage of high-repetition-rate solid-state lasers to deep UV (6 eV). These advances have made lasers powerful processing tools for microfabrication with either the direct-writing or projection technique. In the meantime, the rapid advance in high-speed microelectronics has significantly increased the demand for in situ and adaptive processing techniques for material and device fabrication and for related microelectronic packaging. The high-density chip-to-chip interconnect is becoming the key technology that determines the ultimate device and circuit performances. This paper reviews recent development in applying laser processing to high-density interconnect technology and discusses opportunities for in situ laser processing of materials for microelectronic packaging applications.

© 1990 Optical Society of America