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Dielectric films deposited with the C-MAG™ sputtering process

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Abstract

The introduction of the C-MAG™ rotary cathode has ushered in a new era for thin film sputter deposition of silicon oxides and nitrides. For the first time, production large area DC sputtering of both oxides and nitrides of silicon is possible. The coating is deposited at rates consistent with existing glass sputtering lines and produces near stoichiometric films. The thin films are amorphous, resistant to abrasion, adhere well to plastics, metals and glass, and provide a barrier to gases. The combination of the silicon oxide and nitride coatings with Airco Coating Technology's existing sputtering processes ushers in a new and exciting time for thin film stack development.

© 1990 Optical Society of America

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