Abstract
Substrate-mode holographic optical elements have previously been suggested as a means of reducing many of the problems associated with free-space holographic interconnects. These elements have been formed either in volume materials or as surface relief diffractive (binary) gratings. Each fabrication approach offers certain advantages and drawbacks. In addition, in order to utilize these elements in an operating system, packaging design tolerances must be established. In this presentation design tolerances for substrate mode holograms are reviewed for different classes of interconnects and are used to determine appropriate fabrication and mounting methods. The attributes of the hybrid grating for the interconnect application are also discussed. These components combine the best properties of volume and binary optic elements in a layered structure.
© 1992 Optical Society of America
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