The future of multi-terabit datacenter interconnects based on tight co-integration of photonics and electronics technologies

Maria Spyropoulou; Giannis Kanakis; Giorgos Brestas; Yuqing Jiao; Salim Abdi; Zhaowei Chen; Desalegn Feyisa Wolde; Ripalta Stabile; Nicola Calabretta; Kevin Williams; Virginie Nodjiadjim; Romain Hersent; Agnieszka Konczykowska; Muriel Riet; Richard Schatz; Oskars Ozolins; Oskars Ozolins; Xiaodan Pang; Xiaodan Pang; Mahdieh Joharifar; Jakub Zvěřina; Martin Žoldák; Boaz Atias; Paraskevas Bakopoulos; Elad Mentovich; Hercules Avramopoulos

doi:10.1364/OFC.2023.Tu3I.3

Optical Fiber Communication Conference (OFC) 2023
Technical Digest Series (Optica Publishing Group, 2023),
paper Tu3I.3
•https://doi.org/10.1364/OFC.2023.Tu3I.3

The future of multi-terabit datacenter interconnects based on tight co-integration of photonics and electronics technologies

Maria Spyropoulou, Giannis Kanakis, Giorgos Brestas, Yuqing Jiao, Salim Abdi, Zhaowei Chen, Desalegn Feyisa Wolde, Ripalta Stabile, Nicola Calabretta, Kevin Williams, Virginie Nodjiadjim, Romain Hersent, Agnieszka Konczykowska, Muriel Riet, Richard Schatz, Oskars Ozolins, Xiaodan Pang, Mahdieh Joharifar, Jakub Zvěřina, Martin Žoldák, Boaz Atias, Paraskevas Bakopoulos, Elad Mentovich, and Hercules Avramopoulos

Optical Fiber Communication Conference 2023

San Diego California United States
5–9 March 2023
ISBN: 978-1-957171-18-0

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High-Baud Rate Data Center Technologies (Tu3I)

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M. Spyropoulou, G. Kanakis, G. Brestas, Y. Jiao, S. Abdi, Z. Chen, D. F. Wolde, R. Stabile, N. Calabretta, K. Williams, V. Nodjiadjim, R. Hersent, A. Konczykowska, M. Riet, R. Schatz, O. Ozolins, X. Pang, M. Joharifar, J. Zvěřina, M. Žoldák, B. Atias, P. Bakopoulos, E. Mentovich, and H. Avramopoulos, "The future of multi-terabit datacenter interconnects based on tight co-integration of photonics and electronics technologies," in Optical Fiber Communication Conference (OFC) 2023, Technical Digest Series (Optica Publishing Group, 2023), paper Tu3I.3.

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Abstract

We propose a novel co-packaged optical transceiver architecture capable of operating at 112 Gbaud per lane and scalable to 1.6 Tb/s capacity and beyond for next generation 51.2T and 102.4T digital switches.

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