Solving the Escape Density Problem: Making connections count with SCIP

Rebecca Kayla Schaevitz; Karl Muth; Ying Luo; Vivek Raghuraman; Near Margalit

doi:10.1364/OFC.2023.W4B.2

Optical Fiber Communication Conference (OFC) 2023
Technical Digest Series (Optica Publishing Group, 2023),
paper W4B.2
•https://doi.org/10.1364/OFC.2023.W4B.2

Solving the Escape Density Problem: Making connections count with SCIP

Rebecca Kayla Schaevitz, Karl Muth, Ying Luo, Vivek Raghuraman, and Near Margalit

Optical Fiber Communication Conference 2023

San Diego California United States
5–9 March 2023
ISBN: 978-1-957171-18-0

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Lasers and CPO (W4B)

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R. K. Schaevitz, K. Muth, Y. Luo, V. Raghuraman, and N. Margalit, "Solving the Escape Density Problem: Making connections count with SCIP," in Optical Fiber Communication Conference (OFC) 2023, Technical Digest Series (Optica Publishing Group, 2023), paper W4B.2.

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Abstract

Silicon Photonics Chiplets in Package (SCIP) creates a paradigm shift, enabling escape densities in optics that match the core silicon and creating a scalable platform that meets requirements of future data center and compute architectures.

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