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Improving film stress and surface roughness by using a plasma source in magnetron sputtering

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Abstract

Equipping a magnetron sputter deposition system with an additional plasma source allows to improve surface roughness and film stress independent of the sputter parameters. This will be shown at the example of a HfO2/SiO2 UV mirror and of hydrogenated amorphous silicon.

© 2019 The Author(s)

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