Abstract

To compare monolithic and hybrid optoelectronic technology to electronics for interconnects, this paper considers systems with the same manufacturing cost. For a given cost system, we calculate the performance advantage that makes chip-to-chip optical interconnects competitive with electronic wire bonds and solder bumps. Adjusting the number of I/O connectors by the ratio of the technology defect densities forces the system costs to be identical. Balanced system design principles and present defect densities farther restrict hybrid optoelectronics to a logic/connector ratio of 10⁴ and monolithic integration to a ratio of ten.

© 1995 Optical Society of America