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8x8 Array of optoelectronic switching nodes comprised of flip-chip-solder-bonded MQW modulators on silicon CMOS circuitry

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Abstract

One approach to improving the performance of large processing or telecommunications switching systems is to interconnect integrated circuits using optics. Smart pixels, with integrated optical detectors, modulators, and electronic logic, could potentially be used in these systems. The FET-SEED, consisting of the monolithic integration of multiple quantum well (MQW) optical modulators and detectors with GaAs field effect transistors, is one design platform for these smart pixels [1,2]. Another potential design platform uses the hybrid integration of MQW modulators and detectors with commercial electronic circuits [3-7]. This latter approach allows one to design circuits with greater complexity and circuit yield, because it uses available established VLSI processes.

© 1995 Optical Society of America

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