Expand this Topic clickable element to expand a topic
Skip to content
Optica Publishing Group

GaN µLED on 200mm Silicon Wafer toward Efficient Chip to Chip Communication

Not Accessible

Your library or personal account may give you access

Abstract

We present experimental study of emission and reception of GaN µLED fabricated in a 200mm GaN-on-Si process compatible with ASIC monolithic integration, targeting energy efficient chip-to-chip communication through imaging fiber.

© 2023 The Author(s)

PDF Article
More Like This
Towards Optical Networks-on-Chip with 200mm hybrid technology

J.-M. Fedeli, L. Liu, L. Grenouillet, D. Bordel, F. Mandorlo, N. Olivier, T. Spuesens, P. Régreny, P. Grosse, P. Rojo-Romeo, R. Orobtchouk, and D. Van Thourhout
OMM3 Optical Fiber Communication Conference (OFC) 2011

Scalable on-chip lasers grown on 300 mm Si wafers

Chen Shang, Kaiyin Feng, Eamonn T. Hughes, Andrew Clark, Mukul Debnath, Rosalyn Koscica, Gerald Leake, Joshua Herman, David Harame, Peter Ludewig, Yating Wan, and John E. Bowers
AM3M.6 CLEO: Applications and Technology (CLEO:A&T) 2023

100 Gb/s PSM-4 Silicon Photonics Transceiver for Intra-Datacenter on a 200-mm Wafer

Zhipeng Hu, Sizhu Shao, Zhixiong Xiao, Xingguo Zhu, Yue Wu, Junbo Feng, and Jin Guo
S3D.3 Asia Communications and Photonics Conference (ACP) 2020

Select as filters


Select Topics Cancel
© Copyright 2024 | Optica Publishing Group. All rights reserved, including rights for text and data mining and training of artificial technologies or similar technologies.