16x16 SLM with Silicon CMOS Drivers and III-V Modulators

Mark Hansen; David Shih; Chi Fan; Sadik Esener; Wei Chang; Eli Yablonovitch; Uzi Efron

doi:10.1364/SLMA.1995.LTuA2

Spatial Light Modulators and Applications
Technical Digest Series (Optica Publishing Group, 1995),
paper LTuA2
•https://doi.org/10.1364/SLMA.1995.LTuA2

16x16 SLM with Silicon CMOS Drivers and III-V Modulators

Mark Hansen, David Shih, Chi Fan, Sadik Esener, Wei Chang, Eli Yablonovitch, and Uzi Efron

Spatial Light Modulators and Applications 1995

Salt Lake City, Utah United States
14–16 March 1995
ISBN:

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MQW Spatial Light Modulators (LTuA)

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M. Hansen, D. Shih, C. Fan, S. Esener, W. Chang, E. Yablonovitch, and U. Efron, "16x16 SLM with Silicon CMOS Drivers and III-V Modulators," in Spatial Light Modulators and Applications, Technical Digest Series (Optica Publishing Group, 1995), paper LTuA2.

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Abstract

Hybrid integration of III-V based optical devices, such as modulators, LEDs, and lasers, with silicon VLSI technology promises cost effective solutions to many optoelectronic challenges. It combines the low cost, high density, and high yield of silicon circuitry with the unique optical properties of III-V devices. Flip-chip bonding is a mature and commercial technology. It provides a means of reliable, rapid integration of these two types of devices.¹

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