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X-ray projection lithography is expected as a candidate for VLSI production in the near future. To get a resolution of 0.1μm and wide exposure area simultaneously, reduction systems with aspherical mirrors are required1,2), but the machining precision required to fabricate aspherical surfaces has not been achieved. Thus reduction systems with spherical airrors3-5) are preferable in current study of mounting and alignment of optical elements and resist process.
© 1993 Optical Society of America
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