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  • Applications of Diamond Films and Related Materials: Third International Conference
  • Technical Digest Series (Optica Publishing Group, 1995),
  • paper DP279

Laser Processing of Diamond Substrates for Multichip Modules: Part I

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Abstract

Experimental and numerical data were acquired to study the laser ablation of diamond process for application to multichip modules. Results indicate that plasmas severely limit the thermal efficiency of the process. If the power density exceeds 6.0 × 109W/cm2, atmospheric air ionizes and absorbs up to 90% of the beam's energy before it reaches the target. At lower power densities, air breakdown is avoided, but plasmas comprising ablated material hinder the ablation process. As a result, optimal efficiencies obtained with a Nd:Yag Q-switched pulsed laser were limited to 5-10%.

© 1995 Optical Society of America

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