Abstract

As part of its commitment to support the microelectronics industry, NIST has begun a metrology program in die area of normal incidence, soft x-ray optical systems for use in both basic and applied research. At present, this program consists of dual efforts in the fields of surface figure and surface finish characterization and optical component soft x-ray reflectometry. In this paper, we will focus our discussion on the work performed at NIST using the existing soft x-ray reflectometer, the design characteristics of a new reflectometer which will replace the present instrument, and our plans to build an optical characterization facility based on a real time, two dimensional, soft x-ray imaging system with an ultimate resolution of a few tens of nanometers.

© 1991 Optical Society of America