Abstract

Simulators and materials modeling approaches from optical projection printing provide an advantageous starting point in addressing technology issues in the emerging field of projection x-ray lithography. A brief overview will be given of relevant imaging, resist characterization, resist exposure, resist dissolution, pattern transfer, and electromagnetic scattering programs available from Berkeley. The overview will also highlight important observations drawn from simulation and modeling which are helping optical projection printing at todays 0.35 um feature sizes. Key issues in projection x-ray lithography imaging, materials, and masks where these Technology CAD tools are making an impact will then be discussed.

© 1993 Optical Society of America