Abstract

Resist models to support resist line-edge profile simulation are being developed for soft x-ray projection lithography. Models for resist expos니re, post-exposure bake kinetics, and dissolution surface etching as well as exposure tool imaging are key to balancing tradeoffs between lithographic materials and exposure systems. The SAMPLE lithography simulation program is well suited for supporting the development of this new soft x- ray projection lithography technology once the materials and imaging models are extended.

© 1993 Optical Society of America